The classic function of a socket is to provide a connection mechanism from the integrated circuit (IC) to the circuit board with as little electrical ...

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Watch our video showcasing touch-free BGA component ...

Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are ...

Nanomotion is proud to announce the successful delivery of its first prototype for a .25nm resolution stage designed for semiconductor metrology applications. This groundbreaking ... Semiconductor ...

China's leading chipmaker, Hua Hong, witnessed a triumphant debut on the Shanghai stock market, with its IPO shares surging by 13%. This substantial jump reflects strong investor confidence in the ...

Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.

Brewer Science, Inc. is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025 Critical Materials Council (CMC) Conference ...