OMNIVISION has launched the OX01N1B image sensor for in-cabin automotive driver monitoring systems (DMS).

ByteSnap's SnapPro IQ is a new software tool that’s been designed to test and track printed circuit board assemblies.

First commercial deployment of a MEMS tweeter in AI glasses as xMEMS moves into the fast-expanding AI eyewear market.

Innovate UK has awarded TreQ and a consortium of partners including Rigetti, Oxford Ionics, Q-CTRL, and Qruise, £1.65m to ...

CSignum, a provider of technology extending IoT communications underwater and underground, secures £6m in new funds.

By incorporating training data from Japan’s complex road environments, Wayve will be able to strengthen the generalisation of ...

Weak economic growth and excess inventory, it's been a tough 2024 for distributors. Now Trump’s tariffs add to the mix.

It looks like Samsung will shortly end the production of 1z nm 8Gb LPDDR4, due to intense Chinese competition. Reports ...

Introduced last year the RA0 MCU series has been adopted by a wide range of customers due its affordability and low power ...

VeriSilicon launches the GCNano3DVG, a new ultra-low power graphics processing unit (GPU) IP for wearable devices.

Hirose Electric has launched what it claims is one of the industry’s smallest back flip FPC connectors for automotive and other harsh environment applications.

TSMC reported strong demand for its most advanced chips - 3-5nm - in its latest quarterly update despite US tariffs.