Chiplets can bring together different die technologies together in a single package to address AI/ML applications (see figure). This is already being done but in a proprietary fashion by large OEMs ...

Electronic Design’s intrepid editors returned from the IEEE’s APEC 2025 conference with a heaping helping of the most ...

Ready to make the switch from silicon to silicon carbide? Join experts from Tektronix, Wolfspeed, and PE Systems for a ...

Sonata helps embedded engineers quickly add CHERIoT-based memory protection to IoT, mobile, and OT systems, guarding against ...

We catch up with Aung Thet Tu, APEC 2025 General Chair, on the show floor to talk about the event and the overall power ...

ITEN’s lithium-ion battery advance, which combines the advantages of batteries and supercapacitors, is said to achieve a 200C ...

Power-management solutions developed by Renesas help simplify battery-pack design with fuel-gauge ICs, MCU, pre-validated ...

Andy reflects on how he recently woke up to tariff policies affecting him and his own engineering R&D and thinks that ...

No matter how high the tech, destructive animals, especially rodents, can cause serious damage. Designers must bear in mind ...

Taiwan Semi’s latest single- and dual-output, automotive-grade devices offer what’s claimed as the industry’s best figure of ...

Adoption of 48-V systems will impact everything from components to systems in EV design. The latest advances are helping to ...

The multiple experiments that were run and the overview of results.