From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

independent upper and lower substrate heaters and precise programmable force control during the wafer bonding process. A wafer stack loading arm simplifies the loading and unloading of aligned wafers ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...