According to a study published in Advanced Functional Materials, the refined technique can bypass the high-temperature ...

Diamond quantum sensors can be used to analyze the magnetization response of soft magnetic materials used in power electronics; report scientists based on collaborative research. Using a novel imaging ...

A breakthrough in next-generation semiconductor technology has been announced by Chinese researchers, with the creation of the world’s largest N-polar gallium nitride (GaN) wafer, at eight ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

Wafer Works is expanding beyond silicon-based semiconductors into advanced wide-bandgap materials, particularly in GaN epitaxy for both GaN on silicon and GaN on silicon carbide. Through strategic ...

resulting in the successful fabrication of high-quality GaN epilayers at the wafer scale. (2) A highly controllable roughening process combined with atomic-level sidewall passivation treatment is ...

New diamond bonding technique a breakthrough for quantum devices New technique allows greater integration of synthetic diamonds, improving how both quantum and conventional electronics are built ...

German chipmaker Infineon has successfully developed the world’s first 300mm power gallium nitride (GaN) wafers. The company said that the breakthrough will help to boost the market for GaN-based ...