The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic Materials), by Application (Wafer-level Packaging, ...

DXB is designed to bond wafers using WaferGrip Temporary Adhesive. Dynatex International supplies WaferGrip in various preformed shapes and sizes to suit the required application. This along with the ...

EVG is participating with the following professional development course, papers and posters in the ECTC technical program ...

If you take two objects with fairly smooth surfaces, and put these together, you would not expect them to stick together. At ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...