Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, ...

Gallium nitride, a semiconductor renowned for its efficiency and high-speed capabilities, has long been recognized as a ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above stacks ...

The temporary wafer bonding materials market is expanding rapidly due to advancements in semiconductor packaging, demand for thin wafer processing, and the proliferation of compound semiconductor ...

The growth in advanced packaging technologies such as 2.5D, 3D-ICs, and fan-out packaging is creating a strong demand for temporary wafer bonding materials. These complex architectures involve ...

They describe the use of optical contact bonding in the context of glass-glass for optical and precision engineering, specifically low-expansion fused silica (SiO 2) and ultra-low expansion materials.

EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that it is highlighting its ...

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...

As components become smaller and more complex, the need for advanced temporary bonding materials, like Terefilm®, becomes paramount to enable emerging applications, including thin wafer handling ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

Resonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process and semiconductor ...