From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...