On Wednesday, the chip giant demonstrated its new 3-D packaging technology, called Foveros, which allows it to stack logic chips atop one another. Various methods of going vertical have boosted ...

What is high bandwidth memory? High bandwidth memory (HBM) are basically a stack of memory chips, small components that store data. They can store more information and transmit data more quickly ...

With regards to heat dissipation, the gooey glue would also have the properties of a thermal paste -- though how that helps a chip at the bottom of a 100-storey stack, we're not entirely sure.