AI is transforming SaaS pricing from traditional per-seat licenses to usage-based, pay-as-you-go plans, driven by the rise of ...

TSMC revealed new chip and packaging tech boosting AI performance, with A14 chips coming in 2028 offering 15% more speed or 30% less power. Its advanced wafer system connects 16+ chips. Rivalry with ...

The R3Di system is a self-contained platform for on-site power generation, storage, and distribution that operates without ...