The molded underfill (MK) process for system-in-package (SiP) assembly has been widely used for recent years. In the past, the main structure of the MK was molded flip chip chip scale package (MFCCSP) ...

Delamination between the molding compound and the die surface is a common failure pattern in the semiconductor package industry. Plasma treatment is a standard process to clean and activate the die ...

Scientists discovered a cancer-fighting compound in mold from ancient tombs, revealing a powerful new drug against leukemia.

Scientists have discovered how to turn molecules made by everyday toxic mold into highly effective cancer-fighting drugs.