Glass with hermetic conductive through-hole vias can seal MEMS for 3D wafer-level chip size packaging (WLCSP), according to Schott of Germany. Its product is called Hermes. “Through-glass via ...

SANTA CLARA, Calif., April 22, 2025--(BUSINESS WIRE)--xMEMS Labs, Inc., the global leader in solid-state MEMS speaker technology, today announced that its Cowell MEMS tweeter is now shipping in a ...