A new study reveals glaphene, a hybrid of graphene and silica, showcasing strong interlayer interactions that enhance its potential for innovative applications.

MPS posted a full-year 2024 revenue growth of 21.20%, while the broader analog market declined by 2.4% according to WSTS, ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Market Forecast: Predictions for the future of the semiconductor manufacturing equipment market in Vietnam, including growth projections and potential market size. Emerging Technologies: Exploration ...

Establishment of fully owned subsidiary is the culmination of a decades-long commitment to the region supporting evolving ...

“Today we have a kind of disaggregation of a monolithic IC, where you will have specialized technologies ... “Fusion bonding is really a proven manufacturing process right now for 300mm wafers, and ...

With this evolution, die-to-wafer bonding can enter the realm of memory/logic-on-logic ... containing long-range routing waveguides and passive optical functions, and active photonic IC (PIC) dies ...

With this evolution, die-to-wafer bonding can enter the realm of memory/logic-on-logic ... containing long-range routing waveguides and passive optical functions, and active photonic IC (PIC) dies ...

MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...