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Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...
Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...
We report a new wafer-level packaging technology for miniature MEMS in a hermetic micro-environment. The unique and new feature of this technology is that it only uses low cost wafer-level processes ...
In MEMS industry there is a high demand for reliable hermetic wafer-level encapsulation. This paper presents a methodology to monitor the pressure inside a package after the wafer-level bonding ...
A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...
Acronym for crystal film bonding. OKI’s proprietary heterogeneous material bonding technology involving lifting off crystal films and bonding them to substrates or wafers made of different ...
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