News

IEEE11d
Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications
Abstract: In this paper, various photo-patternable polymer adhesive materials were investigated for the selective wafer bonding of microelectromechanical system (MEMS) motion sensors. Commercially ...
C&EN11d
Flexible Alkali–Halogen Bonding in Two Dimensional Alkali-Metal Organic Frameworks
However, the synthesis of 2D MOFs with large-amplitude flexibility was rarely carried out since the bonding configurations in the coordination nodes are typically highly directional. Here we ...
IEEE11d
Characterization of anodic bondable LTCC for wafer-level packaging
Abstract: This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, ...
Finanznachrichten14d
Semiconductor Wafer Bonding Materials Market to Reach $400.17 Million by 2031, Driven by Packaging Advancements | Valuates Reports
BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...
Yahoo Finance14d
Semiconductor Wafer Bonding Materials Market to Reach $400.17 Million by 2031, Driven by Packaging Advancements | Valuates Reports
BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...
KTAR News25d
Intel confirms advanced silicon wafer tests underway in Arizona
Intel Corp. confirmed that initial production test runs for its most advanced silicon wafer, the 18A, are underway at its Arizona semiconductor plant with plans to ramp up to full volume ...