Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

Hybrid bonding has emerged as a direct solution to accommodate the decreasing bump geometry. However, hybrid bonding requires exceptionally smooth bonding surface — down to 0.3nm - and is highly ...

Wafer-scale heterogeneous integration provides a viable pathway for the development of highly capable microsystems. However, it remains challenging to integrate die-and wafer-level components with a ...