Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...

Acronym for crystal film bonding. OKI’s proprietary heterogeneous material bonding technology involving lifting off crystal films and bonding them to substrates or wafers made of different ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.

BE Semiconductor Industries (Besi) , a supplier of advanced packaging tools for chipmakers, said on Wednesday its order bookings grew in the first quarter as Asian subcontractors ordered more AI ...

This has led to a first demonstration with a Cu bond pad pitch scaling down to 2µm. Hybrid bonding requires very high-quality surface preparation to achieve smooth surfaces with minimal Cu pad recess ...