Gas-insulated transmission line (GIL)/gas-insulated switchgear (GIS) insulators usually withstand complex mechanical stress and strong electric field. This study investigates the insulation properties ...

A series of resins was then prepared varying the epoxide–anhydride ratios. The results gathered from physicochemical, mechanical, morphological analyses have demonstrated that the produced furan-based ...

SanDisk recently announced a partnership with SK Hynix focused on High Bandwidth Flash (HBF), a new technology designed to significantly accelerate the NAND Flash market in terms of storage volumes.

Create a stunning, one-of-a-kind double pendant jewelry piece with this DIY epoxy resin art tutorial! In this video, you’ll learn how to combine wood, color ink, and epoxy resin to craft a ...

Sandisk Corporation (NASDAQ: SNDK) today announced it has signed a landmark Memorandum of Understanding (MOU) with SK hynix to work together to establish the specification for High Bandwidth Flash - a ...

Sandisk and SK hynix announced that they would work together to create standards for high bandwidth NAND flash, HBF modules.

The Next Generation of 3D NAND: Cell Stacking and Cell Scaling In the years to come, the memory industry will push the GAA-based 3D NAND flash roadmap to its ultimate limits.

Bringing with it a higher level of 8K mixed workload performance than we've encountered, Micron's G8 arrayed 9550 Max is a force to be reckoned with.

Kioxia Corporation today announced that it has begun sampling new UFS Ver. 4.1 embedded memory devices designed for automotive applications.

8th Generation KIOXIA BiCS FLASH 3D flash memory UFS Ver. 4.1 devices from KIOXIA integrate the company’s innovative BiCS FLASH 3D flash memory and a controller in a JEDEC ® -standard package.