Create a stunning, one-of-a-kind double pendant jewelry piece with this DIY epoxy resin art tutorial! In this video, you’ll learn how to combine wood, color ink, and epoxy resin to craft a ...

Kioxia Corporation today announced that it has begun sampling new UFS Ver. 4.1 embedded memory devices designed for automotive applications.

Swancor launched recyclable thermosetting epoxy resin “EzCiclo”, leading to zero-carbon era Would you like to be able to recycle and reuse the wind turbine blade materials? Globally, one of the ...

8th Generation KIOXIA BiCS FLASH 3D flash memory UFS Ver. 4.1 devices from KIOXIA integrate the company’s innovative BiCS FLASH 3D flash memory and a controller in a JEDEC ® -standard package.

The increasing integration of NOR Flash memory in the automotive sector highlights a pivotal development in the advancement of Electric Vehicles (EVs). As demand rises for efficient and high ...

Sandisk targets to deliver first samples of its HBF memory in the second half of calendar 2026 and expects samples of the first AI-inference devices with HBF to be available in early 2027.

SanDisk recently announced a partnership with SK Hynix focused on High Bandwidth Flash (HBF), a new technology designed to significantly accelerate the NAND Flash market in terms of storage volumes.

The Next Generation of 3D NAND: Cell Stacking and Cell Scaling In the years to come, the memory industry will push the GAA-based 3D NAND flash roadmap to its ultimate limits.

Bringing with it a higher level of 8K mixed workload performance than we've encountered, Micron's G8 arrayed 9550 Max is a force to be reckoned with.

FMS: The Future Of Memory and Storage (formerly Flash Memory Summit) August 5, 2025 - August 7, 2025 ...