InfoWorld13h
Microsoft’s first step to scalable quantum computing
After many years of work, Microsoft has unveiled its first quantum hardware, the Majorana 1 processor. Let’s grok its ...
Semiconductor Engineering14h
Back-End Packaging And Test: From Lessons Learned To Future Innovations
The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...
insideHPC4h
Vanguards of HPC-AI: Spack Builder Todd Gamblin of LLNL on the Why’s and How’s of Change in HPC
In our continuing series on current and future leaders of HPC-AI, Lawrence Livermore National Lab's Todd Gamblin has a ...
Semiconductor Engineering14h
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That ...
Interesting Engineering4h
Microsoft’s Majorana 1: What a new state of matter means for quantum computing
By integrating topoconductors and Majorana particles, Microsoft has mapped out a viable route to a million-qubit quantum chip ...
EDN13h
A new platform for thermally stable DRAM peripheral transistors
Until 2018, DRAM peripheral transistors were predominantly made in planar logic MOSFET technology with poly-Si/SiO 2 or ...