The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

Successful Demonstration Shows Promise for High-Performance and Mass-Manufacturable Quantum Photonic Circuits on Silicon GOLETA, CA / ACCESS Newswire / May 29, 2025 / Aeluma, Inc. (NASDAQ:ALMU), a sem ...

SK Hynix is gearing up to kick off mass production of its 12-High HBM4 modules in October 2025, a move timed to support the ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Abstract: A hybrid multilayer interconnect process and high-throughput die-to-wafer bonding technology were developed and introduced into the SMAFTI (SMArt chip connection with FeedThrough Interposer) ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Delta Electronics, a global leader in power management and smart green solutions, is showcasing its Digital Twin Solution at ...

Abstract: The integration of a varifocal mirror with a scanner using wafer bonding technology is presented. The wafer bonding technology enables us to enlarge the design possibility. A 2 mm diameter ...

In an era demanding ever-smaller, more efficient, and higher-performing light sources, particularly in the short-wave ...

The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

EVG is participating with the following professional development course, papers and posters in the ECTC technical program ...