The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

Successful Demonstration Shows Promise for High-Performance and Mass-Manufacturable Quantum Photonic Circuits on Silicon GOLETA, CA / ACCESS Newswire / May 29, 2025 / Aeluma, Inc. (NASDAQ:ALMU), a sem ...

SK Hynix is gearing up to kick off mass production of its 12-High HBM4 modules in October 2025, a move timed to support the ...

Measuring 0.066 cm/sup 3/ in volume, and complete with a fuel manifold and set of fuel injector holes, the fabrication of the device was largely enabled by the use of deep reactive ion etching (DRIE) ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Abstract: A hybrid multilayer interconnect process and high-throughput die-to-wafer bonding technology were developed and introduced into the SMAFTI (SMArt chip connection with FeedThrough Interposer) ...