The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

Successful Demonstration Shows Promise for High-Performance and Mass-Manufacturable Quantum Photonic Circuits on Silicon GOLETA, CA / ACCESS Newswire / May 29, 2025 / Aeluma, Inc. (NASDAQ:ALMU), a sem ...

SK Hynix is gearing up to kick off mass production of its 12-High HBM4 modules in October 2025, a move timed to support the ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Delta Electronics, a global leader in power management and smart green solutions, is showcasing its Digital Twin Solution at ...

In an era demanding ever-smaller, more efficient, and higher-performing light sources, particularly in the short-wave ...

The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...