Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...

In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to ...

Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding dielectric, delivering up to 1,000X more connections than copper ...

It vertically links die-to-wafer or wafer-to-wafer via closely spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a single bonding step. However, the enhanced reliability ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

The system's installation also marks the start of Fraunhofer's Bond-Hub, which will additionally comprise a multitude of leading-edge temporary as well as permanent wafer-to-wafer and die-to-wafer ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...