Evrima Chicago. NAPERVILLE, IL / ACCESS Newswire / July 12, 2025 / In our hyper-visible era, your digital presence isn’t just ...

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This work demonstrates the building of 64 nm pitch copper single and dual damascene interconnects using pitch split double patterning scheme to enable sub 80 nm pitch patterning. A self-aligned-via ...

A self-aligned via(SAV) process was employed to build 64nm pitch Dual-Damascene(DD) interconnects using a pitch split double exposure pattering scheme to form the Cu lines. TiN hardmask (HM) density ...

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Zhang, X. (2025) The Hidden Double Burden: Formation Mechanisms of Stigma and Nursing Strategies for Male Breast Cancer ...

Key Takeaways "Double dipping"—a.k.a. layering two of the same piece, from tank tops to bikinis to bloomers—is taking over as ...