At a recent packaging conference, Amazon's and Microsoft's progress in transitioning to sustainable packaging at scale was ...

Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...

Department of Electrical and Computer Engineering, Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, United States ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Abstract: A cost effective and reliable technology allowing extreme miniaturization of batteries into silicon, glass chips and electronic packages has been developed, employing a dispense-print ...

SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a technology expected to be introduced for the artificial ...

At the heart of Innovate Together was the launch of the SiC Open R&D Line. Designed to enable joint SiC innovation between ...

STMicroelectronics, a long-standing investor in Singapore’s semiconductor industry, views Lab-in-Fab as a critical asset for its Ang Mo Kio campus. It complements the company’s existing volume ...

The proliferation of connected devices and the rapid advancement of IoT ecosystems are creating new opportunities for MEMS sensors. These sensors play a vital role in enabling real-time monitoring, ...

What if you'd invested in Lam Research (LRCX) ten years ago? It may not have been easy to hold on to LRCX for all that time, but if you did, how much would your investment be worth today? With that in ...

Leibniz Institute of Photonic Technology, Albert-Einstein-Str. 9, 07745 Jena, Germany Abbe Center of Photonics and Faculty of Physics, Friedrich-Schiller-Universität Jena, Max-Wien-Platz 1, 07743 Jena ...