News

The Cool Down1d
Amazon and Microsoft unveil surprising insights on future plans for their products: 'Our engineers are building tools that didn't exist before'
At a recent packaging conference, Amazon's and Microsoft's progress in transitioning to sustainable packaging at scale was ...
Silicon Semiconductor1d
Marvell delivers advanced packaging platform for custom AI accelerators
Marvell Technology has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that ...
IEEE1d
A Hybrid MEMS Microphone Combining Piezoelectric and Capacitive Transduction Mechanisms
Abstract: This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone based on combined piezoelectric and capacitive transduction mechanisms to enhance the sensitivity. The ...
Silicon Semiconductor4d
Towards next-generation edge-AI technologies
The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...
C&EN5d
Self-Rolled-Up Aluminum Nitride-Based 3D Architectures Enabled by Record-High Differential Stress
Department of Electrical and Computer Engineering, Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, United States ...
TMCnet5d
EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...
IEEE6d
Gas Detection Microsystem With MEMS Gas Sensor and Integrated Circuit
Abstract: In this paper, a gas detection microsystem which consists of a highly sensitive micro-electro mechanical systems (MEMS) gas sensor and a CMOS integrated circuit, including a read-out circuit ...