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A project in the UK and the Netherlands is using Large Language Models (LLMs) to create hardware designs with a technique it calls Conversational Prototyping. While LLMs are widely used for developing ...
The point that Europe has no appetite for manufacturing chips is underlined decisively by the sales of semiconductor manufacturing equipment in 2024, as compiled by the industry body SEMI. European ...
DVCon Europe 2024 will be held from October 15-16, 2024 at the Holiday Inn Munich City Centre, Munich, Germany. The Design and Verification Conference in Europe (DVCon Europe) is the leading European ...
David Lazovsky, CEO of Celestial AI tells eeNews Europe about its terabit optical interconnect and analog technology to reduce the power consumption of high performance AI chips and chiplets. Thermal ...
The automotive industry was perhaps the saving grace of the European semiconductor industry in 2023, but reality has hit hard in 2024. The European Commission will start talks in the New Year on the ...
Powercast has teamed with Etherdyne Technologies in the US to develop a truly wire free desk. The Wire-Free Power Minimalist Desk demonstrates how magnetic resonance technology can provide up to 100W ...
Flow Computing in Finland has started alpha testing of a RISC-V compiler for its Parallel Processing Unit (PPU) AI block. The PPU is capable of increasing any CPU architecture by up to 100X by using ...
Autotalks is working with Yunex Traffic on privacy and security capabilities on V2X Roadside Units. The Yunex RSU2X roadside units use the Autotalks chipset to fully comply with the North America ...
Chinese electronics giant Huawei is testing elements for an extreme ultraviolet (EUV) lithography machine at its Dongguan facility, according to two sources posting photographs on X social media. The ...
AI processor IP licensing startup RaiderChip Sl. (Solares, Spain) has raised €1 million in a seed funding round. RaiderChip, founded in 2024 by CTO Victor Lopez, is developing an IP core aimed at ...
Chinese-owned Silex Microsystems AB (Järfälla, Sweden), the world’s largest pure-play foundry for MEMS components, has announced it plans to build a 300mm wafer fab. The fab will be located close to ...
Neo said it has developed both one transistor, one capacitor (1T1C) and three transistor, zero capacitor (3T0C) X-DRAM cells that are stackable. The company said that TCAD simulation has predicted the ...
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