Smaller models and accelerated compute are transforming AI at the edge.

A platform-based approach to multiphysics simulation that gives engineering teams the tools to design, verify, and optimize ...

Ferguson: This is a big part of what’s driving consolidation within the EDA industry. You see Siemens and Mentor and Altair ...

Even worse, chips and systems are now so complex that it may require a unique sequence of operations to trigger a silent data error, and they may only show up occasionally, and maybe only after months ...

A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.

EDA and silicon IP revenue grew 12.8% in Q1 2025, totaling $5.098 billion compared to $4.522 billion in the same period last ...

Cognichip’s approach is to develop a physics-informed foundation model that achieves more parallelism than is available in ...

Intent and integrity in signoff; LPDDR in data centers; PCB stackup materials; what's new in MIPI; analog challenges.

The latest advancements in these specifications and their potential to change vision and imaging technologies.

An overview of the MRDIMM technology as a solution to memory bandwidth and capacity challenges.

A new technical paper titled “Reduced Topography After Stop on Nitride (SON) STI CMP Through Improved Post-Bulk Planarity for ...

AMD is grabbing share from Intel in x86 data center processors at a rapid rate. As the chart above shows, AMD’s share is now ...