Broadcom Corporation announced the world's first family of eight new hybrid satellite and terrestrial system-on-a-chip (SoC) broadcast devices for set-top boxes (STBs).

HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...

Cadence Design Systems, Inc. announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC’s 16nm FinFET process, enabling joint ...

As the first pump manufacturer and water solutions provider to receive full validation from the Science Based Targets initiative (SBTi) for its 2050 net-zero emissions target, Grundfos is committed to ...

Chang explained that this nimble hand imitates the design of human fingers, utilizing pneumatic transmission to control its movement with a US-patented precise pressure sensing device that responds to ...

TAIPEI, Taiwan - Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest ...

HSINCHU, Taiwan - Scientists have long been struggling to develop high-performance fuel cells as environmentally friendly power in electric vehicles. However, Prof. Chen Tsan-Yao of the Department of ...

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“In previous years, the research on the high-speed green micro-LED always kept a slow pace due to its bottleneck originating from both material and device designs. The newly announced Green Micro-LED ...

Shipment volume of the global Wi-Fi (Wireless-Fidelity) connected devices is estimated at 3.1 billion units in 2021, nearly 50% of which will be Wi-Fi 6 connected devices, according to MIC (Market ...

The immense computing power of AI is reshaping the technology industry. From the development of ChatGPT by OpenAI in late 2022 to the launch of Sora, a text-to-image AI capable of generating 60-second ...