Consequently, some developers are turning to a two-wafer solution using hybrid bonding, but these improvements will go only so far. “While cutting-edge manufacturers are always looking at increasing ...

3D DRAM stacking is also expected to utilize Wafer-to-Wafer (W2W) hybrid bonding, a technology already utilized in NAND and CMOS Image Sensors (CIS). At the same time, Samsung is also researching ...

In figure 1, we present a single wafer defect map, lot stack defect map and lot stack probe bin map. In the map for a stacked probe map with a micro crack (fig 1c), the red dies indicate the frequency ...

Map B (Connected from A to B) ^ Map A (Main map) In this case, if you have an event on the top border of Map B, it would crash. The direction in which the connection is made would mean that the ...

This is the preferred method to install Wafermap, as it will always install the most recent stable release. If you don't have pip installed, this Python installation ...

Back before COVID-19, I was walking through the airport towards the gate when suddenly I remembered a document I wanted to read on the flight but had forgotten to bring along. No worry, I paused ...

Abstract: Automatic identification of defect patterns in wafer bin maps (WBMs) stands as a challenging problem for the semiconductor manufacturing industry. Deep convolutional neural networks have ...