DXB is designed to bond wafers using WaferGrip Temporary Adhesive. Dynatex International supplies WaferGrip in various preformed shapes and sizes to suit the required application. This along with the ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...