The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Several critical decisions go into the thinning and processing of thin device wafers. Which temporary bonding adhesive is most compatible with the process flow? Can it fix the thin wafer in place ...

According to a press release, the temporary library will be used over the next several months as the main library undergoes renovations as part of the city’s $20 million bond that passed in November ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...

The number of temporary residents in Canada has declined for the first time in three years, after a series of policy changes introduced by Ottawa last year to reduce immigration levels.

EV Group, an Austria-based supplier of equipment and process solutions for semiconductors, showed the next-generation version of GEMINI automated production wafer bonding system for 300-mm wafers. EVG ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...