This study introduces a groundbreaking SOI-based temporary bonding technique for 3DIC, resolving significant challenges in thermal management and interlayer alignment. This platform can achieve ...

Different from Chip on Wafer stacking technology, Wafer on Wafer (WoW) stacking can provide a tighter pitch and higher interconnect density with higher through-put. The difficulty for WoW stacking is ...

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above stacks ...

NTT Innovative Devices developed chips by forming UTC-PDs in the device process on SiC wafers with crystal films bonded using CFB technology. The results of device evaluations following chip ...

In wafer bonding, due to the large bonding area, even a minute bonding defect at one location can cause a bonding failure over a large area. Therefore, more advanced bonding technology is required ...

In integrated circuit manufacturing, chemical mechanical polishing (CMP) is used to control the surface roughness of wafers and other substrates—a key factor influencing the reliability of final ...