Valuates Reports Logo. The Temporary Wafer Bonding Materials Market was estimated to be worth USD 269.58 Million in 2024 and is forecast to a readjusted size of USD 400.17 Million by 2031 with a ...

TOKYO, September 19, 2024--Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication and packaging.

EQS-News: SÜSS MicroTec SE / Key word(s): Miscellaneous Temporary bonding solutions from SUSS MicroTec enable . Tuesday, 02 January 2024 12:17 GMT. عربي. Log in ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, Tuesday, 02 January 2024 12:17 GMT.

Resonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process and semiconductor ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

TOKYO--(BUSINESS WIRE)-- Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

Major Factors Driving the Growth of Temporary Wafer Bonding Materials Market: The temporary wafer bonding materials market is expanding rapidly due to advancements in semiconductor packaging, demand ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...