Package cracking during reflow soldering process is the great problem in the reliability of plastic packages. The technique of lowering the glass transition temperature (Tg) of a molding compound is ...

Delamination between the molding compound and the die surface is a common failure pattern in the semiconductor package industry. Plasma treatment is a standard process to clean and activate the die ...

Scientists discovered a cancer-fighting compound in mold from ancient tombs, revealing a powerful new drug against leukemia.

Scientists have discovered how to turn molecules made by everyday toxic mold into highly effective cancer-fighting drugs.