Co-molding SMC with braided glass fiber demonstrates truck bed potential Prepreg co-molding compound by IDI Composites International and A&P Technology enables new geometries and levels of strength ...

Delamination between the molding compound and the die surface is a common failure pattern in the semiconductor package industry. Plasma treatment is a standard process to clean and activate the die ...

The molded underfill (MK) process for system-in-package (SiP) assembly has been widely used for recent years. In the past, the main structure of the MK was molded flip chip chip scale package (MFCCSP) ...