siliconsemiconductor4h
EV Group highlights 'revolutionary' temporary wafer bonding and debonding solution
EV Group (EVG) is highlighting its industry-leading IR LayerRelease™ temporary bonding and debonding (TB/DB) solution, as ...
siliconsemiconductor21h
EV Group to showcase temporary wafer bonding for HBM & 3D DRAM in Korea
Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...