Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in ... and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers ...

D bioprinting holds great potential in the field of regenerative medicine to produce miniaturized tissues and organ ...

DGCpac, one of the country’s leading packaging materials supply platforms, plans to give packaging materials for rent and launch a product as a service (PAAS) facility soon, its founder and ...

As connected packaging evolves into mainstream CPG products, the technology can be used to expand on a brand’s sustainability ...

Queensland University of Technology (QUT) researchers have identified a new material which could be used as a flexible ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

Aegis's O₂X technology enhances recyclable packaging with high barrier performance, promoting the shift from non-recyclable ...

Engineers have fabricated a metamaterial that is not only strong but also stretchy. Their new method could enable stretchable ceramics, glass, and metals, for tear-proof textiles or stretchy ...

The field of two-dimensional (2D) materials is rapidly developing, driven by ongoing demands in the semiconductor industry to produce efficient, scalable, ...

Inoac has been manufacturing sustainable packaging for many years—but Lustrino says Eastman’s materials are the answer to being sustainable while maintaining a brand’s packaging esthetic. “In the past ...

As MEMS devices are being integrated into packages of various shapes, sizes, and materials, the MEMS community is taking note of the importance and the value of P/A/T in the creation of MEMS-based ...

Connecting Multiphysics, Microfabrication, and System Integration (MEMS+CMOS) through IntelliSuite at NIT Trichy. IntelliSense Software Connecting Multiphysics… | Sripadaraja K. Ph.D ...