TEM image of 16nm pitch Ru lines after Ru etch. Ruthenium (Ru) semi-damascene has been originally proposed by imec as an ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

A high-pure Si multiplication layer is prepared via Si film stripping technology based on Si/Si wafer bonding. The plasma surface treatment and water ultrasonic processing are used to enhance the ...

MPS posted a full-year 2024 revenue growth of 21.20%, while the broader analog market declined by 2.4% according to WSTS, highlighting MPS’s strong position in a weak market. We examine the company’s ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Market Forecast: Predictions for the future of the semiconductor manufacturing equipment market in Vietnam, including growth projections and potential market size. Emerging Technologies: Exploration ...

However, the initial development costs remain prohibitively high, primarily due to the substantial investment required for TSV formation at the wafer level ... direct bonding, and hybrid bonding, for ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

EV Group says that new developments in heterogeneous integration enabled by its wafer-to-wafer and die-to-wafer hybrid bonding, maskless lithography, metrology and infrared (IR) laser release ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS ...