Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

EV Group says that new developments in heterogeneous integration enabled by its wafer-to-wafer and die-to-wafer hybrid bonding, maskless lithography, metrology and infrared (IR) laser release ...

However, the initial development costs remain prohibitively high, primarily due to the substantial investment required for TSV formation at the wafer level ... direct bonding, and hybrid bonding, for ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

July 13, 2021 -- IC Insights’ Global Wafer Capacity 2021-2025 report breaks out the world’s installed monthly wafer capacity by geographic region (or country). Figure 1 shows the installed capacity by ...

Despite high development costs, using smaller nodes yield larger revenue per wafer. February 20, 2020 -- The success and proliferation of integrated circuits has largely hinged on the ability of IC ...

Advanced technology development: Leveraging TFI's newly patented TSV deposition process and Heisler Semiconductor's expertise ...

At the heart of the case are two key technologies: CMOS image sensors (CIS) and hybrid bonding, a method crucial to next-generation high-bandwidth memory (HBM) packaging and wafer-to-wafer ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS ...