TEM image of 16nm pitch Ru lines after Ru etch. Ruthenium (Ru) semi-damascene has been originally proposed by imec as an ...

End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

Abstract: We investigate multi-stack dielectric wafer bonding through two integration schemes, which provide different paths to realize vertical integration of multiple device layers. Key process ...

A high-pure Si multiplication layer is prepared via Si film stripping technology based on Si/Si wafer bonding. The plasma surface treatment and water ultrasonic processing are used to enhance the ...