Advanced technology development: Leveraging TFI's newly patented TSV deposition process and Heisler Semiconductor's expertise ...

Reliance on existing wafer sizes increases as outlook for 450mm wafers fades. December 16, 2016 -- IC Insights has just released its new Global Wafer Capacity 2017-2021—Detailed Analysis and Forecast ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

A new study reveals glaphene, a hybrid of graphene and silica, showcasing strong interlayer interactions that enhance its potential for innovative applications.

A high-pure Si multiplication layer is prepared via Si film stripping technology based on Si/Si wafer bonding. The plasma surface treatment and water ultrasonic processing are used to enhance the ...

The GlobalWafers GmbH-Bond has a maturity date of 1/23/2029 and offers a coupon of 1.5000%. The payment of the coupon will take place 1,0 times per Year on the 23.01.. The GlobalWafers GmbH-Bond ...

TEM image of 16nm pitch Ru lines after Ru etch. Ruthenium (Ru) semi-damascene has been originally proposed by imec as an ...

Abstract: We investigate multi-stack dielectric wafer bonding through two integration schemes, which provide different paths to realize vertical integration of multiple device layers. Key process ...