With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important ... devices have compelled the manufacturers to utilize ...

These connections must ensure high density, efficient data transfer, and effective power delivery. This has led to an increased demand for advanced packaging that features a higher number of ...

High Density Interconnect Market to Witness Significant ... TTM Technologies has invested significantly in R&D to enhance its HDI PCB manufacturing capabilities. Similarly, Ibiden has expanded ...

Ribbon Communications announced that Diabolocom has selected Ribbon’s high density Data Center Interconnect (DCI) solution. The solution enables Diabolocom to seamlessly and efficiently connect its ...

And with low I/O voltages and tiny rise times, a point-to-point interconnect presents increased timing, signal-integrity, and board-design challenges. Into this scenario of growing complexity has come ...