Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...

Researchers have developed a breakthrough semiconductor alloy that paves the way for advanced quantum, photonic, and ...

Researchers find that drying hydrogels briefly turns them into strong, reversible adhesives, opening new uses in robotics and material handling.