Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to ...

Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding dielectric, delivering up to 1,000X more connections than copper ...

SAN DIEGO – June 2, 2022 – In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to ...

Process tools for hybrid bonding must meet critical process specs, such as incredibly flat 300mm wafer polishing (<1nm center-to-edge non-uniformity), zero particles on bonded wafers, 100nm die ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...

EVG is participating with the following professional development course, papers and posters in the ECTC technical program ...

The system's installation also marks the start of Fraunhofer's Bond-Hub, which will additionally comprise a multitude of leading-edge temporary as well as permanent wafer-to-wafer and die-to-wafer ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Dr. Thomas Workman, senior principal engineer for Adeia and author of the paper, received the award for “Fine Pitch Die-to-Wafer Hybrid Bonding,” which explores the range of parameters ...