The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

Successful Demonstration Shows Promise for High-Performance and Mass-Manufacturable Quantum Photonic Circuits on Silicon GOLETA, CA / ACCESS Newswire / May 29, 2025 / Aeluma, Inc. (NASDAQ:ALMU), a sem ...

SK Hynix is gearing up to kick off mass production of its 12-High HBM4 modules in October 2025, a move timed to support the ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Delta Electronics, a global leader in power management and smart green solutions, is showcasing its Digital Twin Solution at ...

Abstract: In this paper, various photo-patternable polymer adhesive materials were investigated for the selective wafer bonding of microelectromechanical system (MEMS) motion sensors. Commercially ...

Abstract: We present a varifocal mirror integrated with a comb-drive scanner (varifocal scanner) fabricated by using a wafer bonding technology. An Au-Au thermocompression bonding technology is ...

In an era demanding ever-smaller, more efficient, and higher-performing light sources, particularly in the short-wave ...

The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...

BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...