SK Hynix is gearing up to kick off mass production of its 12-High HBM4 modules in October 2025, a move timed to support the ...

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Abstract: A hybrid multilayer interconnect process and high-throughput die-to-wafer bonding technology were developed and introduced into the SMAFTI (SMArt chip connection with FeedThrough Interposer) ...