Researchers at the University of Tokyo have developed a 3D cooling system that uses boiling water to dissipate heat from microchips up to seven times more efficiently than conventional methods.

As chips get smaller and more powerful, keeping them cool becomes a serious bottleneck—until now. A research team from the ...

However, with advancements in technology, the process has become easier, thanks to cheaper 3D scanners and user-friendly ...

"Trying to find a way to also bring costs down." Developer shares first-of-its-kind 3D-printed house with a head-turning look ...