The next-generation hybrid SoIC package also combines thermoplastic carbon fiber composite molding technology. While the base M5 is expected to use about the same architecture as the M4 chips ...

Apple’s manufacturing partners have begun packaging the upcoming M5 chips, reports ETNews. Packaging is the process of wiring up the raw silicon die and placing it in a protective case.

$172m project expected to be supported by $15.7m in other state funding Macom Technology has signed a preliminary memorandum of terms with the US federal government for funding under the CHIPS for ...

Today is no different, and we’ve been looking at [Modustrial Maker]’s stylish epoxy LED cube. The build starts with the casting of a black epoxy cube, with a cutout near the top in which the ...

Or perhaps not, if [mitxela]’s hand-soldering of a tiny ball-grid array chip is any guide. While soldering wires directly to a chip is certainly a practical skill and an impressive one at that ...