The next-generation hybrid SoIC package also combines thermoplastic carbon fiber composite molding technology. While the base M5 is expected to use about the same architecture as the M4 chips ...

Apple’s manufacturing partners have begun packaging the upcoming M5 chips, reports ETNews. Packaging is the process of wiring up the raw silicon die and placing it in a protective case.

$172m project expected to be supported by $15.7m in other state funding Macom Technology has signed a preliminary memorandum of terms with the US federal government for funding under the CHIPS for ...