The compute power required by AI and HPC is skyrocketing and driving a global transition from 10-15 megawatt data centers to ...

Gospower delivered a keynote speech highlighting its pioneering immersion cooling technologies, positioning itself at the forefront of next-generation AI server power thermal management innovation.

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” was published by researchers at University of Illinois, Urbana, University ...

With heavier scaling of IT infrastructure, air cooling is becoming insufficient and therefore the telecom operators are moving towards direct-to-chip and immersion cooling in search of performance ...

Hyperscalers and other data center operators are turning towards immersion cooling as it offers significantly higher thermal efficiency and allows for greater rack density and energy savings ...

The event brought together over 500 industry experts and 10+ Intel ecosystem partners. Gospower delivered a keynote speech highlighting its pioneering immersion cooling technologies, positioning ...